Semiconductor diamond - the ultimate semiconductor material, diamond - diamond wafer semiconductor
Diamond, also known as diamond, is currently mainly used in industrial cutting, jewelry making, and the semiconductor field. Due to its excellent physical properties, diamond is hailed as the ultimate semiconductor material and is a key component of national strategic industries. Taking Gaoxin Semiconductor (Henan) Co., Ltd., a joint venture between the Henan Provincial Government and me, as an example, we mainly produce diamonds for heat dissipation. In the development of high-energy-consumption technologies such as current large models, heat dissipation is a crucial issue, accounting for 70% of total energy consumption. The use of diamond materials can effectively reduce 70% of heat dissipation energy consumption and significantly improve energy efficiency.
The company actively responds to the transformative opportunities in the global semiconductor cooling field, continuously invests in research and development resources, strives to enhance the generation efficiency of functional diamonds, and reduce production costs. Its aim is to bring the price of functional diamonds down to below 100 yuan per carat and expand into the civilian market. The company focuses on meeting customer needs by providing splicable cubic high-power monocrystals. It is committed to promoting the application of functional diamond cooling to a wide range of civilian fields, making continuous breakthroughs in core technologies, and anticipating a promising future. Meanwhile, jewelry-grade diamonds have gradually gained widespread social recognition. In the era of rapid technological development, we will continue to work hard to lay a solid hardware foundation for the competition in the future chip industry.
Functional diamond won the second prize in the 2023 Zhengchuanghui International Innovation and Entrepreneurship Competition; taking functional diamond as a new starting point for a new business, we are fully committed to the field of diamond semiconductors.
It can be applied to high-power RF devices such as RF amplifiers and microwave amplifiers, high-power devices such as high-power laser diode, laser diode array, and high-power transistors, as well as compound semiconductor devices such as GaN, GaA, and SiC.
Ultra-high thermal conductivity diamond possesses characteristics such as high mechanical strength, good insulation, low dielectric constant, and light weight. Its thermal conductivity at room temperature is up to five times higher than that of copper, allowing semiconductor devices to achieve higher power density and improved reliability in a smaller space. It is the optimal thermal management material for heat dissipation of high heat flux density devices.
Size: 1-4 inches (size and shape can be customized according to customer requirements) Room temperature thermal conductivity: 1200-2000W/m·K
